Photoresist Coating / Developing Equipment

No. 1711

Asking Price: 18,500 Euro

Lithographic process system with flexible material flow, modular design and high throughput.
Process modules with pick and place robot handling for wafers as well as for a variety of other substrates up to 150 mm (6".
Set up for 75mm and 100mm (3" and 4") wafers. (optional 150mm (6")

Small footprint, only 700mm (28") wide, 1200mm (48") deep.

System consists of:
*Sender/Receiver module for Standard Cassettes
*Developer Module for positive, PMMA and negative developer
* Frogleg Robot
* Hotplate
* Coolplate

Kuhnke 653 W Programmable Process Controller and ILONA menu controller at operator interface, onscreen operator guidance, single wafer data acquisition and record keeping, Host computer and CIM interface (SECS I/II)

SN: VS 11206
Vintage 1995

No. 1712

Asking Price: 15,500 Euro

Lithographic process system with flexible material flow, modular design and high throughput.
Process modules with pick and place robot handling for wafers as well as for a variety of other substrates up to 150 mm (6") diameter.
Set up for 75mm and 100 mm (3" and 4") wafers. (optional 150mm (6")

Small footprint, only 700mm (28") wide, 1200mm (48") deep.

System consists of:
*Sender/Receiver module for Standard Cassettes
*Developer Module for spray or puddle negative developer or Propanole.
Kuhnke 653W Programmable process Controller and ILONA menu controller at operator interface, onscreen operator guidance, single wafer data acquisition and record keeping, Host computer and CIM interface (SECS I/II)
incl. 2 pressurized 5 liter Canister

SN: VS10821
Vintage 1994

No. 2709

System consists of:

* 1 Sender module for Standard Cassettes
* 1 wafer transport including U-turn module
*Coater module: 3 nozzles for PMMA, positive or negative Photoresist, Polyimides, lift off processes
* 1 Hot Plate
* 1 Cool Plate
* 1 Receiver module for Standard Cassettes
* 1 Jabola Chillers

No. 3714

Lithographic process system with flexible material flow, modular design and high throughput.
Process modules with pick and place robots handling for wafers as well as for a variety of other substrates up to 150 mm (6") diameter.

Small footprint, only 1680 mm (66") wide, 1100mm (44") deep.

System consists of:
* 4 Sender/Receiver module for Standard Cassettes
* 2 Developer Module for spray or puddle developer
* 3 Froglegs Robots
* 3 Hotplates
* 1 Coolplate

Kuhnke 653W Programmable process Controller and ILONA menu controller at operator interface, onscreen operator guidance, single wafer data acquisition and record keeping, Host computer and CIM interface (SECS I/II)
incl.
4 pressurized 10 liter Canisters,
3 Chiller Heaters

SN: VS11477
Vintage: March 1996

No. 6038

Acrobat positive photoresist system for coating and developing processes

1 I/O Module with 4 Carrier Ports
1 Cabinet and linear handling
1 Media Cabinet
1 Coater Module with 2 photoresist pumps
1 Developer Module
1 HMDS
4 Hot Plates
4 Chill Plates
2 Low-Contact Chuck
1 Computer
1 TFT Monitor
1 additional control panel for greyroom
1 retrofit 100mm and 150mm

System generally

* Substrate sizes: 100mm and 150mm wafer (other sizes optional)
* Footprint: 2286 x 1468mm
* Wafer transport height: Central Handling: 1193 - 1674mm
I/O handling: 998 - 1228mm
* Recipe entries: 17 "Screen 1024 x 768 pixels
(Optional: LCD touch screen)
* Investment Structure: Refer to diagram
* Connection: Electrical supply (coming from the house):
3 x 400 V + N + PE, 37.5A
System protection: 40 A

* Media supply of external (home care):
. 1 air max. Inlet pressure 10 bar, usually 0,5 - 8,5 bar
. 2 nitrogen: max. Inlet pressure 10 bar, usually 0,5 - 7 bar
. 3 DI water: max. 8 bar inlet pressure, control range 0.5 - 4 bar
. 4 Vacuum: 0.9 bar ± 0.1 bar
. 5 Exhaust: 150 m3 / h

Plant control

Host

Function: Control and presentation of the material flow through the system management, backup and create the module and flow Recipes media monitoring

* Construction: Industrial PC with hardware and floppy disk, LCD, WIN NT, Ethernet TP interface

* Module Converter
Function: control flow of the module Recipes

Construction: - PLC (PMA / Berghof)
- Control software according to IEC 1131-4

Communication
Function: Transfer of prescriptions from the host module to module

Structure: - Distributed Control Architecture
Ethernet TP: connection via central star (HUB)
Protocol: Host - Module: SECS II / GEM (HSMS) over TCP / IP
Module - sensor / actuator: CAN-Open

Input / output module (I / O)
Function: module is to transfer the to be processed or processed wafers from carriers and transfer to them to and from the central handling.
Features: Seamless vacuum gripper system
Panel port per carrier (selection of a flow prescription, start, stop, cancel, pilot wafer start, status indicators)

Assembly:

Carrier ports
Suitable carriers sizes: 100mm and 150mm
Number: 4, leveled
Carrier detection: microswitch
Wafers in carrier detection: photoelectric sensor with mirror

Handling unit
Drives: x-and z-axis: Spindle Drive
y-axis: Belt drive
Wafer consumption: ceramic vacuum grasper

Features:
* Dispatching of wafers of different sizes via appropriate allocation formula

Central handling
Function: transport of substrates from the wafer through the system and for each process module according to the input flow Recipes

Features: Double gripper system for standard wafer

Assembly:

* Handling Unit
Drives: x-and z-axis: Spindle Drive
y-axis: Belt drive
phi-axis: Belt drive with gearbox
Wafer receiving: Vacuum Gripping Edge loose with three-point support (Peek)

Coater Module for positive photoresist applications

Function: Spin-process module for coating semiconductor substrates with positive resist (AZ 4562 and AZ 1514H) back flushing, flushing pot, edge bead removal

Features:

- Back Gentle Chuck
- Fixation on wafer chuck vacuum
- Rota-stop function
- Pre-and Dummy dispense function
- Service position for paint quantity determination
- Integrated control panel for spec. Process and service support
- Back flushing and flushing pot
- Dispense Arm: max. 3 nozzles
- Edge bead removal

Assembly:

* Chuck
Wafer detection: vacuum sensor with display query on Chuck
Wafer fixation on Chuck: Vacuum
Chuck Material: PEEK

* Process Cup Assembly materials and Process Cup
Process Cup: Process Cup size uniform with matching spray rings for 1200mm and 150mm substrates
Process Cup tray: Polypropylene (PP)
Distribute ring back and ring flush: PP
Nozzle inserts for back flushing
Thrower: PP
Drive: Pneumatic linear actuator (cylinder)
Process Engine: AC servo motor
Motor flange cooling: Water-cooled with Julabo FC600S
unregulated
Procedure: collection container 10ltr or 20ltr (PP)
may direct drain disposal in house
Exhaust: 2-point switching via rotary cylinder
(Butterfly valve on / mechanically adjustable)
Monitoring sensor

* Resist dispense Arm
z Drive: Pneumatic linear actuator (cylinder)
phi Drive: brushless EC motor plus gear
Arm temperature to Point-of-use through
Julabo F-31
Nozzle: 3 x PFA

* EBR Arm
z Drive: Pneumatic linear actuator (cylinder)
phi Drive: Brushless EC motor
RE-Nozzle: 0.4 mm, VA

* Media Supply Systems
Pumps: 1 Iwaki SB Type and WaferTeK S11
Filter: Millipore Wafergard FWGFV 40H P1
low-viscosity resists (<25 cps): 0.1 micron
medium viscosity photoresists (<50 cps): 0.2 micron
Solvents (<5 cP): 0.1 micron
Tube Material: PFA
Solvent supply: pressure tank system 10 ltr stainless steel tank), central filling with automatic switching

Photoresist supply: Bottle
Leak detection: opt. Sensor in tub
Flowmeter: bead removal: 6 - 40 mL / min
Back flushing: 6-40 ml / min
Solvent bath: 6 - 40 mL / min
Spread flushing ring: 80 - 650 ml / min
Features:
* Formulation
Number of recipes: 99
Number of recipe steps: 32
Max Step Time: 999.9 s

* Process Engine
Speed range: -10000 - +10000 U / min
Acceleration: 50000 r / min / s
Max speed deviation: ± 2 U

* Arms
Dispense Arm:
Possible arm positions: 0 - 70° (degrees)
Positioning accuracy: ± 0.5 mm

EBR Arm:
Possible arm positions: -70 - 0° (degrees)
Positioning accuracy: ± 0.5 mm

Developer module for positive resist

Function: spin-processing module for developing with photoresist (positive resist) coated semiconductor substrates. Back flushing, flushing pan, DI water rinse

Features:
- Back Gentle Chuck
- Fixation on wafer chuck vacuum
- Rota-stop function
- To point-of-use with 2 tempered Developer Dispense Arms puddle nozzle
- 2 x DI water puddle nozzle
- Back and Process Cup irrigation
- Pre-and Dummy dispense function
- Integrated control panel for spec. Process and service support

Assembly:
* Chuck
Wafer detection: vacuum sensor with display query on Chuck
Vacuum generation on Chuck: Vacuum
Chuck Material: PEEK

* Process Cup construction and materials
Process Cup with flushing ring: PP, uniform size Process Cup with matching spray rings for 100mm and 150mm substrates
Distribute ring with back flushing: polypropylene,
Nozzle inserts for back flushing
Process Cup irrigation:
Drive: Pneumatic linear actuator (cylinder)

* Process Drive: AC servo motor
Motor Flange Cooling: water-cooled with
Julabo FC 600S, unregulated
Procedure: Direct drain disposal in house
Exhaust: 2-point switching via rotary cylinder
(Butterfly valve on / mechanically adjustable)

* Developer Arm
z Drive: Pneumatic linear actuator (cylinder)
phi - Drive: Brushless EC motor + gearbox
Arm tempered to the point-of-use, controlled
Developers nozzles: 2x 5-hole puddle nozzle
Water Nozzles: 2x Puddle Nozzles, 4 mm

* Media Supply Systems
Developer: pressure tank system (5 liters) with automatic
Switching and level query
DI water: direct connection to electrical supply with bypass

Filters:
- Developer medium: 0.1 micron
- DI water: 0.1 micron
Tube Material: PFA
Media Temperature Control: heat exchanger and Julabo F 31C
Measurement in the head: 1 x PT100
Control: 1 x Julabo F31 C
Leak detection: optical Sensor inside the tube
Flowmeter: Developer: Max. 1000 ml / min
Back flushing: max. 100 ml / min
DI water from above: max. 1000 ml / min
Process Cup irrigation: max. 2000 ml / min

* Temperature Module 1
2 hotplates
2 Cool Plates

Hotplate **:
Function: Process module for uniform baking
-coated BCB semiconductor substrates

Features:
- Hot plate for 100 or 150mm respective substrate size
- Proximity Bake
- Uniform atmosphere with central suction,
4-fold N2 supply and closed chamber
- Temperature range: 50 - 350° C in 0.1° units

Assembly:
* Hot plate
* Diameter: 240 mm
* Lower plate material: AlMgSi1
* Material Upper panel: Alimex ACP 6000,
hard coated plate
* Heating element: heating film, heating max. 1000W
* Temperature measurement: PT 100
* Temperature control: PID controller
Over temperature switch: max. Value: 380° C

* Cassette
Base: anodized aluminum,
Cassette body: mirror sheet
Inner cover: VA
Suction: centrally from above

* Pins
Drive: pneumatic pin drive
Pins: hollow pins with support from Peek
Wafer detection: vacuum sensor query

* Media Systems
- Nitrogen supply: 1 cable per stack
(4 cassettes) to split each 1 per lead
Cassette control over throttle per cartridge
- Extraction: 1 cable per stack (with 4 cassettes)
split to feed each 1 per cartridge,
Via throttle valve per cassette
- Suction control: STEFA-switch, pressure range for
a static vacuum of about 50 Pa per
Stack temperature measurement points per cartridge
- Tube material: PFA
- Filter: Millipore Wafergard FII Micro
- Nitrogen 0.03 micron, 1 filter per stack temperature

Features:

* Formulation
- Number of recipes: 99
- Number of recipe steps: 32
- Max Step Time: 999.9 s

* Temperature uniformity
50 - 110° C <0.6° C
111 - 150° C <0.8° C
151 - 200° C <1.1° C
201 - 250° C <1.5° C
251 - 300° C <2.0° C
301 - 350° C <2.5° C

Cool Plate:
* Function:
Temperature module for cooling with
Photoresist-coated and baked
Semiconductor substrates as well as for generating a
defined temperature condition

* Features:

- Cooling plate for 100mm and 150mm
- Temperature range: 10 - 35° C in 0.1° C units
- Wafer detection through pin vacuum

- Uniform atmosphere with central suction, throttle valve 4x N2 supply and closed heating chamber

* Construction:

Cooling plate
- Diameter: 240 mm
- Lower plate material: AlMgSi1
- Material Upper panel: Alimex ACP 6000, hard-coated plate
- Temperature: water / glycol
- Temperature measurement: PT 100

Cassette
- Base: anodized aluminum,
- Cassette body: mirror sheet
- Inner cover: VA
- Extraction: centrally from above

Pins
- Drive: pneumatic pin drive flap
- Pins: hollow pins with support from Peek
- Wafer detection: vacuum sensor query

Media systems
- Nitrogen supply: 1 cable per stack
(4 cassettes) to split each 1 supply
per cartridge, control over throttle per cartridge
- Extraction: 1 cable per stack (with 4 cassettes)
split to feed each 1 per cartridge
Via throttle valve per cassette
- Suction control: STEFA-switch, pressure range
for a static Vacuum of about 50 Pa per
Stack temperature measurement points per cartridge
- Tube material: PFA
- Filters:
- Nitrogen Millipore Wafergard FII Micro 0.03 microns,
1 filter per stack temperature
- DI water 0.1 microns (see Media Cabinet)

Features:

* Formulation
- Number of recipes: 99
- Number of recipe steps: 32
- Max Step Time: 999.9 s

* Temperature uniformity
10 - 30° C <1° C

* Temperature stack 2

- 2 hotplates
- 1 Cool Plate

* Priming module stack

1 priming Plate and 1 Cool Plate

Function: Process module for uniform vapor deposition of semiconductor substrates with adhesion promoter (hexamethyldisilazane) at a controlled suction

Features:

- Proximity hot plate for 100mm and 150mm
- Temperature range: 50 - 350° C in 0.1° units
- Uniform atmosphere with central suction
and closed chamber
2 separate suction zones + Module Exhaust

Assembly:

* Hot plate
- Diameter: 240 mm
- Lower plate material: AlMgSi1
- Material Upper panel: Alimex ACP 6000, hard plate-
coated
- Heating element: heating film, heating max. 1000W
- Temperature measurement: PT 100
- Temperature control: PID controller
- Over-temperature switch: max. Value: 380° C

* Cassette
- Base plate: aluminum coated
- Cassette body: mirror sheet
- Inner cover: VA
- Extraction: centrally from above
- HMDS supply: directly from above

* Pins
- Drive: pneumatic pin drive
- Pins: hollow pins with support from Peek
- Wafer detection: vacuum sensor query

* Media Systems

- HMDS care and feeding: N2 tank bubbled
(Bottle), control over flow meter
Split 1 cable per stack (with 4 cassettes)
1 per cartridge depending on supply, control over throttle
per cartridge
Monitoring the HMDS feed
- Extraction: Priming Chamber:
1 cable per stack (with 4 cassettes)
split to feed each 1 per cartridge
adjustable choke on
Cassette:
4 suction openings (diameter 6mm)
per cassette in the base plate outside
the hot plate
Module:
1 suction per stack
(4 cassettes) to split each 1
Suction per cartridge,
mechanically adjustable
- Suction control: STEFA-switch, pressure range for
a static vacuum of about 50 Pa per
Stack temperature measurement points per cartridge
- Tube material: PFA
- Filters:
- Nitrogen Millipore Wafergard FII Micro 0.03 microns,
1 filter per stack temperature

Features:

* Formulation
Number of recipes: 99
Number of recipe steps: 32
Max Step Time: 999.9 s

* Temperature uniformity
50 - 110° C < 0.6° C
111 - 150° C < 0.8° C
151 - 200° C < 1.1° C

No. 6112

- Wafersize 200mm
- 1 Coater Module, 1 Developer Module
- several Cool und Hotplates
- 1x HH Plate up to 350°C
- I/O Moduel with 4 Carriers
- 4x Photoresist Pumps, 2 Developer Lines
- Still operational in the clean room