BLE Acrobat Coater and Developer

No. 6038

Acrobat positive photoresist system for coating and developing processes

1 I/O Module with 4 Carrier Ports
1 Cabinet and linear handling
1 Media Cabinet
1 Coater Module with 2 photoresist pumps
1 Developer Module
1 HMDS
4 Hot Plates
4 Chill Plates
2 Low-Contact Chuck
1 Computer
1 TFT Monitor
1 additional control panel for greyroom
1 retrofit 100mm and 150mm

System generally

* Substrate sizes: 100mm and 150mm wafer (other sizes optional)
* Footprint: 2286 x 1468mm
* Wafer transport height: Central Handling: 1193 - 1674mm
I/O handling: 998 - 1228mm
* Recipe entries: 17 "Screen 1024 x 768 pixels
(Optional: LCD touch screen)
* Investment Structure: Refer to diagram
* Connection: Electrical supply (coming from the house):
3 x 400 V + N + PE, 37.5A
System protection: 40 A

* Media supply of external (home care):
. 1 air max. Inlet pressure 10 bar, usually 0,5 - 8,5 bar
. 2 nitrogen: max. Inlet pressure 10 bar, usually 0,5 - 7 bar
. 3 DI water: max. 8 bar inlet pressure, control range 0.5 - 4 bar
. 4 Vacuum: 0.9 bar ± 0.1 bar
. 5 Exhaust: 150 m3 / h

Plant control

Host

Function: Control and presentation of the material flow through the system management, backup and create the module and flow Recipes media monitoring

* Construction: Industrial PC with hardware and floppy disk, LCD, WIN NT, Ethernet TP interface

* Module Converter
Function: control flow of the module Recipes

Construction: - PLC (PMA / Berghof)
- Control software according to IEC 1131-4

Communication
Function: Transfer of prescriptions from the host module to module

Structure: - Distributed Control Architecture
Ethernet TP: connection via central star (HUB)
Protocol: Host - Module: SECS II / GEM (HSMS) over TCP / IP
Module - sensor / actuator: CAN-Open

Input / output module (I / O)
Function: module is to transfer the to be processed or processed wafers from carriers and transfer to them to and from the central handling.
Features: Seamless vacuum gripper system
Panel port per carrier (selection of a flow prescription, start, stop, cancel, pilot wafer start, status indicators)

Assembly:

Carrier ports
Suitable carriers sizes: 100mm and 150mm
Number: 4, leveled
Carrier detection: microswitch
Wafers in carrier detection: photoelectric sensor with mirror

Handling unit
Drives: x-and z-axis: Spindle Drive
y-axis: Belt drive
Wafer consumption: ceramic vacuum grasper

Features:
* Dispatching of wafers of different sizes via appropriate allocation formula

Central handling
Function: transport of substrates from the wafer through the system and for each process module according to the input flow Recipes

Features: Double gripper system for standard wafer

Assembly:

* Handling Unit
Drives: x-and z-axis: Spindle Drive
y-axis: Belt drive
phi-axis: Belt drive with gearbox
Wafer receiving: Vacuum Gripping Edge loose with three-point support (Peek)

Coater Module for positive photoresist applications

Function: Spin-process module for coating semiconductor substrates with positive resist (AZ 4562 and AZ 1514H) back flushing, flushing pot, edge bead removal

Features:

- Back Gentle Chuck
- Fixation on wafer chuck vacuum
- Rota-stop function
- Pre-and Dummy dispense function
- Service position for paint quantity determination
- Integrated control panel for spec. Process and service support
- Back flushing and flushing pot
- Dispense Arm: max. 3 nozzles
- Edge bead removal

Assembly:

* Chuck
Wafer detection: vacuum sensor with display query on Chuck
Wafer fixation on Chuck: Vacuum
Chuck Material: PEEK

* Process Cup Assembly materials and Process Cup
Process Cup: Process Cup size uniform with matching spray rings for 1200mm and 150mm substrates
Process Cup tray: Polypropylene (PP)
Distribute ring back and ring flush: PP
Nozzle inserts for back flushing
Thrower: PP
Drive: Pneumatic linear actuator (cylinder)
Process Engine: AC servo motor
Motor flange cooling: Water-cooled with Julabo FC600S
unregulated
Procedure: collection container 10ltr or 20ltr (PP)
may direct drain disposal in house
Exhaust: 2-point switching via rotary cylinder
(Butterfly valve on / mechanically adjustable)
Monitoring sensor

* Resist dispense Arm
z Drive: Pneumatic linear actuator (cylinder)
phi Drive: brushless EC motor plus gear
Arm temperature to Point-of-use through
Julabo F-31
Nozzle: 3 x PFA

* EBR Arm
z Drive: Pneumatic linear actuator (cylinder)
phi Drive: Brushless EC motor
RE-Nozzle: 0.4 mm, VA

* Media Supply Systems
Pumps: 1 Iwaki SB Type and WaferTeK S11
Filter: Millipore Wafergard FWGFV 40H P1
low-viscosity resists (<25 cps): 0.1 micron
medium viscosity photoresists (<50 cps): 0.2 micron
Solvents (<5 cP): 0.1 micron
Tube Material: PFA
Solvent supply: pressure tank system 10 ltr stainless steel tank), central filling with automatic switching

Photoresist supply: Bottle
Leak detection: opt. Sensor in tub
Flowmeter: bead removal: 6 - 40 mL / min
Back flushing: 6-40 ml / min
Solvent bath: 6 - 40 mL / min
Spread flushing ring: 80 - 650 ml / min
Features:
* Formulation
Number of recipes: 99
Number of recipe steps: 32
Max Step Time: 999.9 s

* Process Engine
Speed range: -10000 - +10000 U / min
Acceleration: 50000 r / min / s
Max speed deviation: ± 2 U

* Arms
Dispense Arm:
Possible arm positions: 0 - 70° (degrees)
Positioning accuracy: ± 0.5 mm

EBR Arm:
Possible arm positions: -70 - 0° (degrees)
Positioning accuracy: ± 0.5 mm

Developer module for positive resist

Function: spin-processing module for developing with photoresist (positive resist) coated semiconductor substrates. Back flushing, flushing pan, DI water rinse

Features:
- Back Gentle Chuck
- Fixation on wafer chuck vacuum
- Rota-stop function
- To point-of-use with 2 tempered Developer Dispense Arms puddle nozzle
- 2 x DI water puddle nozzle
- Back and Process Cup irrigation
- Pre-and Dummy dispense function
- Integrated control panel for spec. Process and service support

Assembly:
* Chuck
Wafer detection: vacuum sensor with display query on Chuck
Vacuum generation on Chuck: Vacuum
Chuck Material: PEEK

* Process Cup construction and materials
Process Cup with flushing ring: PP, uniform size Process Cup with matching spray rings for 100mm and 150mm substrates
Distribute ring with back flushing: polypropylene,
Nozzle inserts for back flushing
Process Cup irrigation:
Drive: Pneumatic linear actuator (cylinder)

* Process Drive: AC servo motor
Motor Flange Cooling: water-cooled with
Julabo FC 600S, unregulated
Procedure: Direct drain disposal in house
Exhaust: 2-point switching via rotary cylinder
(Butterfly valve on / mechanically adjustable)

* Developer Arm
z Drive: Pneumatic linear actuator (cylinder)
phi - Drive: Brushless EC motor + gearbox
Arm tempered to the point-of-use, controlled
Developers nozzles: 2x 5-hole puddle nozzle
Water Nozzles: 2x Puddle Nozzles, 4 mm

* Media Supply Systems
Developer: pressure tank system (5 liters) with automatic
Switching and level query
DI water: direct connection to electrical supply with bypass

Filters:
- Developer medium: 0.1 micron
- DI water: 0.1 micron
Tube Material: PFA
Media Temperature Control: heat exchanger and Julabo F 31C
Measurement in the head: 1 x PT100
Control: 1 x Julabo F31 C
Leak detection: optical Sensor inside the tube
Flowmeter: Developer: Max. 1000 ml / min
Back flushing: max. 100 ml / min
DI water from above: max. 1000 ml / min
Process Cup irrigation: max. 2000 ml / min

* Temperature Module 1
2 hotplates
2 Cool Plates

Hotplate **:
Function: Process module for uniform baking
-coated BCB semiconductor substrates

Features:
- Hot plate for 100 or 150mm respective substrate size
- Proximity Bake
- Uniform atmosphere with central suction,
4-fold N2 supply and closed chamber
- Temperature range: 50 - 350° C in 0.1° units

Assembly:
* Hot plate
* Diameter: 240 mm
* Lower plate material: AlMgSi1
* Material Upper panel: Alimex ACP 6000,
hard coated plate
* Heating element: heating film, heating max. 1000W
* Temperature measurement: PT 100
* Temperature control: PID controller
Over temperature switch: max. Value: 380° C

* Cassette
Base: anodized aluminum,
Cassette body: mirror sheet
Inner cover: VA
Suction: centrally from above

* Pins
Drive: pneumatic pin drive
Pins: hollow pins with support from Peek
Wafer detection: vacuum sensor query

* Media Systems
- Nitrogen supply: 1 cable per stack
(4 cassettes) to split each 1 per lead
Cassette control over throttle per cartridge
- Extraction: 1 cable per stack (with 4 cassettes)
split to feed each 1 per cartridge,
Via throttle valve per cassette
- Suction control: STEFA-switch, pressure range for
a static vacuum of about 50 Pa per
Stack temperature measurement points per cartridge
- Tube material: PFA
- Filter: Millipore Wafergard FII Micro
- Nitrogen 0.03 micron, 1 filter per stack temperature

Features:

* Formulation
- Number of recipes: 99
- Number of recipe steps: 32
- Max Step Time: 999.9 s

* Temperature uniformity
50 - 110° C <0.6° C
111 - 150° C <0.8° C
151 - 200° C <1.1° C
201 - 250° C <1.5° C
251 - 300° C <2.0° C
301 - 350° C <2.5° C

Cool Plate:
* Function:
Temperature module for cooling with
Photoresist-coated and baked
Semiconductor substrates as well as for generating a
defined temperature condition

* Features:

- Cooling plate for 100mm and 150mm
- Temperature range: 10 - 35° C in 0.1° C units
- Wafer detection through pin vacuum

- Uniform atmosphere with central suction, throttle valve 4x N2 supply and closed heating chamber

* Construction:

Cooling plate
- Diameter: 240 mm
- Lower plate material: AlMgSi1
- Material Upper panel: Alimex ACP 6000, hard-coated plate
- Temperature: water / glycol
- Temperature measurement: PT 100

Cassette
- Base: anodized aluminum,
- Cassette body: mirror sheet
- Inner cover: VA
- Extraction: centrally from above

Pins
- Drive: pneumatic pin drive flap
- Pins: hollow pins with support from Peek
- Wafer detection: vacuum sensor query

Media systems
- Nitrogen supply: 1 cable per stack
(4 cassettes) to split each 1 supply
per cartridge, control over throttle per cartridge
- Extraction: 1 cable per stack (with 4 cassettes)
split to feed each 1 per cartridge
Via throttle valve per cassette
- Suction control: STEFA-switch, pressure range
for a static Vacuum of about 50 Pa per
Stack temperature measurement points per cartridge
- Tube material: PFA
- Filters:
- Nitrogen Millipore Wafergard FII Micro 0.03 microns,
1 filter per stack temperature
- DI water 0.1 microns (see Media Cabinet)

Features:

* Formulation
- Number of recipes: 99
- Number of recipe steps: 32
- Max Step Time: 999.9 s

* Temperature uniformity
10 - 30° C <1° C

* Temperature stack 2

- 2 hotplates
- 1 Cool Plate

* Priming module stack

1 priming Plate and 1 Cool Plate

Function: Process module for uniform vapor deposition of semiconductor substrates with adhesion promoter (hexamethyldisilazane) at a controlled suction

Features:

- Proximity hot plate for 100mm and 150mm
- Temperature range: 50 - 350° C in 0.1° units
- Uniform atmosphere with central suction
and closed chamber
2 separate suction zones + Module Exhaust

Assembly:

* Hot plate
- Diameter: 240 mm
- Lower plate material: AlMgSi1
- Material Upper panel: Alimex ACP 6000, hard plate-
coated
- Heating element: heating film, heating max. 1000W
- Temperature measurement: PT 100
- Temperature control: PID controller
- Over-temperature switch: max. Value: 380° C

* Cassette
- Base plate: aluminum coated
- Cassette body: mirror sheet
- Inner cover: VA
- Extraction: centrally from above
- HMDS supply: directly from above

* Pins
- Drive: pneumatic pin drive
- Pins: hollow pins with support from Peek
- Wafer detection: vacuum sensor query

* Media Systems

- HMDS care and feeding: N2 tank bubbled
(Bottle), control over flow meter
Split 1 cable per stack (with 4 cassettes)
1 per cartridge depending on supply, control over throttle
per cartridge
Monitoring the HMDS feed
- Extraction: Priming Chamber:
1 cable per stack (with 4 cassettes)
split to feed each 1 per cartridge
adjustable choke on
Cassette:
4 suction openings (diameter 6mm)
per cassette in the base plate outside
the hot plate
Module:
1 suction per stack
(4 cassettes) to split each 1
Suction per cartridge,
mechanically adjustable
- Suction control: STEFA-switch, pressure range for
a static vacuum of about 50 Pa per
Stack temperature measurement points per cartridge
- Tube material: PFA
- Filters:
- Nitrogen Millipore Wafergard FII Micro 0.03 microns,
1 filter per stack temperature

Features:

* Formulation
Number of recipes: 99
Number of recipe steps: 32
Max Step Time: 999.9 s

* Temperature uniformity
50 - 110° C < 0.6° C
111 - 150° C < 0.8° C
151 - 200° C < 1.1° C