ALCATEL SCM 650 Sputtering System with Loadlock

No. 5456

TYPE: SCM 650, Serial No. Z225.560

APPLICATION: RF/DC sputtering(with or without bias)
Ionic cleaning.

PROCESS GAS: Argon, Nitrogen.

CHAMBER: Stainless steel chamber 650mm diameter, fitted with port-holes, flanges for measure instruments.
Port pumping 160mm diameter.

CATHODES: 2 magnetron targets 200mm diameter.

SUBSTRATE TRANSPORT
LOAD LOCK: for 150mm diameter substrates.
SUBSTRATE HOLDER: 4 stations.
6 indexed positions 4 transfer positions
+ 2 sputtering positions)
Continuous rotation 1 to 30 r.p.m.
Vertical translation 50 to 100mm

SHUTTER: One 3/4 automatic shutter.

GENERATORS: 1 RF-Generator (2000 W) for the targets 1 and 2 and the substrate-holder
1 DC-Generator (3000 W) for the targets 1 and 2
PUMPING
. LOAD LOCK: Rough : rotary vane pump 2012 A (15 m3/h)
. CHAMBER: Rough : rotary vane pump 2033 A (35 m3/h)
. Secondary: Turbomolecular Pump 5402 CP (380 l/s)
. INTER-SEAL: Rough : rotary vane pump 1004 A (4.5 m3/h)

MEASURES
. LOAD LOCK: Rough vacuum: Pirani: PB 122
. CHAMBER: Rough vacuum: Pirani: PB 111
: Secondary vacuum: Bayard Alpert BN 111
: Process vacuum: Baratron MN 121

GAS LINES: 2 lines

MACHINE CONTROL : Programmable logic controller
SIEMENS Simatic with an OP 395.

FACILITIES
. ELECTRICAL: Voltage 380V three phases + neutral + earth.
: Power 18 kVA.
. WATER: Flow (min.) 15 l/min, pressure 6 bar.
. COMPRESSED AIR: Pressure 6 barĀ± 0,5
. DRY NITROGEN: Pressure 1.5 bar.

DIMENSIONS: Width 2970mm.
: Height 1930mm.
: Depth 1800 mm

WEIGHT: Roughly 940kg (machine) 575kg (cabinets)

including: complete documentation

CE-Marked